Ruggedized avionics with stiffening frames for use on kinetically launched vehicles

ABSTRACT

Ruggedized avionics assemblies for use on kinetically launched space vehicles are disclosed. The avionic assemblies are able to maintain structural integrity and functionality under high acceleration forces generated during kinetic launch, including acceleration forces of &gt;5,000 times Earth&#39;s gravity in a single direction of loading. The avionics assembly is ruggedized to withstand this level of acceleration force during launch via a plurality of constraining elements to constrain a plurality of printed circuit boards aligned in parallel to an acceleration vector. Further, a high specific strength and stiffness composition of the plurality of constraining elements aids in supporting the printed circuit boards and preventing them from bending and dislodging electronic components mounted to the printed circuit boards.

CROSS REFERENCE TO RELATED APPLICATION

This application is a Divisional Application of U.S. patent applicationSer. No. 16/718,252, filed on Dec. 18, 2019, which is herebyincorporated by reference in its entirety, including all references andappendices cited therein.

FIELD OF THE INVENTION

The present disclosure relates generally to the field of kineticallylaunched vehicles and satellites, and more specifically to structuralassemblies and methods for ruggedizing avionics on kinetically launchedvehicles such that the avionics maintain structural integrity during thehigh acceleration forces generated during a kinetic launch.

SUMMARY

This summary is provided to introduce a selection of concepts in asimplified form that are further described in the Detailed Descriptionbelow. This summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used as an aid in determining the scope of the claimed subjectmatter.

Various embodiments of the present disclosure may be directed to methodsand apparatuses for providing ruggedized avionics for use with vehiclesand satellites configured for a kinetic space launch. The avionicsmaintain structural integrity and functionality of the electroniccomponents on printed circuit boards (PCBs) under high accelerationforces generated during kinetic launch, including acceleration forcesof >5,000 times Earth's gravity in a single direction of loading. Theavionics assembly is ruggedized to withstand this level of accelerationforce during launch via a plurality of constraining elements (e.g.,slots) to constrain a plurality of printed circuit boards alignedapproximately in parallel to an acceleration vector. Further, a highspecific strength and/or stiffness composition of the plurality ofconstraining elements aids in supporting the printed circuit boards andpreventing them from bending and dislodging electronic componentsmounted to the printed circuit boards. Additionally, board-to-boardconnections allow communication of power and signals between the printedcircuit boards, eliminating the need to ruggedize wires. The presentdisclosure allows for the launch of spacecrafts, vehicles, or satellitesvia a kinetic launcher, which generates loading forces in the oppositedirection of acceleration.

Other examples and embodiments are discussed in further detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

Certain embodiments of the present disclosure are illustrated by theaccompanying figures. It will be understood that the figures are notnecessarily to scale and that details not necessary for anunderstanding, or that render other details difficult to perceive, maybe omitted. Embodiments are illustrated by way of example and not bylimitation in the figures of the accompanying drawings, in which likereferences indicate similar elements.

FIG. 1A depicts a front view of an exemplary embodiment of a ruggedizedavionics assembly for use on kinetically launched vehicles.

FIG. 1B depicts a top view of an exemplary embodiment of ruggedizedavionics assembly for use on kinetically launched vehicles.

FIG. 1C depicts an exploded view of an exemplary embodiment ofruggedized assembly avionics for use on kinetically launched vehicles.

FIG. 2 depicts an exemplary method for providing ruggedized avionicsassemblies for use of kinetically launched vehicles.

FIG. 3A depicts a front view of another exemplary embodiment ofruggedized avionics assembly for use on kinetically launched vehicles.

FIG. 3B depicts a back view of another exemplary embodiment ofruggedized avionics assembly for use on kinetically launched vehicles.

FIG. 3C depicts a top view of another exemplary embodiment of ruggedizedavionics assembly for use on kinetically launched vehicles.

FIG. 4A depicts a front view of another exemplary embodiment ofruggedized avionics assembly for use on kinetically launched vehicles.

FIG. 4B depicts a top view of another exemplary embodiment of ruggedizedavionics assembly for use on kinetically launched vehicles.

FIG. 4C depicts an exploded view of another exemplary embodiment ofruggedized avionics assembly for use on kinetically launched vehicles.

DETAILED DESCRIPTION

The following detailed description includes references to theaccompanying drawings, which form a part of the detailed description.The drawings show illustrations in accordance with example embodiments.These example embodiments, which are also referred to herein as“examples,” are described in enough detail to enable those skilled inthe art to practice the present subject matter. The embodiments can becombined, other embodiments can be utilized, or structural, logical, andother changes can be made without departure from the scope of what isclaimed. The following detailed description is therefore not to be takenin a limiting sense, and the scope is defined by the appended claims andtheir equivalents.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescription of the present technology has been presented for purposes ofillustration and description, but is not intended to be exhaustive orlimited to the present technology in the form disclosed. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the presenttechnology. Exemplary embodiments are chosen and described in order tobest explain the principles of the present technology and its practicalapplication, and to enable others of ordinary skill in the art tounderstand the present technology for various embodiments with variousmodifications as are suited to the particular use contemplated.

Aspects of the present disclosure are described herein with reference toflowchart illustrations and/or block diagrams of methods, and apparatus(systems) according to embodiments of the present technology. Theflowchart illustrations and/or block diagrams in the Figures illustratethe architecture, environment, functionality, and operation of possibleimplementations of systems, methods and apparatuses according to variousembodiments of the present disclosure. It should also be noted that, insome alternative implementations, the functions noted in the block mayoccur out of the order noted in the figures. For example, two blocksshown in succession may, in fact, be executed substantiallyconcurrently, or the blocks may sometimes be executed in the reverseorder, depending upon the functionality involved.

In the following description, for purposes of explanation and notlimitation, specific details are set forth, such as particularembodiments, procedures, techniques, etc. in order to provide a thoroughunderstanding of the present invention. However, it will be apparent toone skilled in the art that the present invention may be practiced inother embodiments that depart from these specific details.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the present invention. Thus, theappearances of the phrases “in one embodiment” or “in an embodiment” or“according to one embodiment” (or other phrases having similar import)at various places throughout this specification are not necessarily allreferring to the same embodiment. Furthermore, the particular features,structures, or characteristics may be combined in any suitable manner inone or more embodiments. Furthermore, depending on the context ofdiscussion herein, a singular term may include its plural forms and aplural term may include its singular form. Similarly, a hyphenated term(e.g., “on-demand”) may be occasionally interchangeably used with itsnon-hyphenated version (e.g., “on demand”), a capitalized entry (e.g.,“Panel”) may be interchangeably used with its non-capitalized version(e.g., “panel”). Such occasional interchangeable uses shall not beconsidered inconsistent with each other.

Also, some embodiments may be described in terms of “means for”performing a task or set of tasks. It will be understood that a “meansfor” may be expressed herein in terms of a structure, device,composition, or combinations thereof.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, steps, operations, elements, components, and/or groupsthereof.

Satellites are used for many purposes and are traditionally launchedinto Earth orbit or beyond via a rocket-propelled launch vehicle.Traditional rockets carry massive quantities of propellant to deliverpayloads that are minute fractions of the overall vehicle sizes andweights. All of the performance and risks are built into a precision,often single-use vehicle that must be highly reliable and inherentlycostly.

While incremental gains have been made in rocket technologies to reducespace launch costs, alternative approaches are necessary to reduce thosecosts and increase launch rates by the orders of magnitude necessary tocreate exponential growth in the space transportation industry. Sincethe beginning of the space program, ground-based non-rocket launchsystems such as rail guns and ram accelerators have been proposed toachieve this. Additionally, centripetal launchers, such as one describedin related U.S. Pat. No. 10,059,472 issued on Aug. 28, 2018 and entitled“Circular Mass Accelerator” may be used instead of a rocket-propelledspace launch.

Use of kinetic energy to provide the energy needed to launch a payloadinto space (instead of rocket propulsion), requires high accelerationforces to be generated at launch to ensure the payload has sufficientvelocity to actually reach Earth orbit or beyond. Kinetically launchedsatellites and spacecrafts are satellites and spacecrafts launched intoEarth orbit with the assistance of a ground-based mass accelerationtechnology, such as a centripetal launcher. Kinetic launchers subjectthe satellites to static or quasi-static acceleration loading in excessof 5,000 times Earth's gravity (G-force). As such, kinetically launchedsatellites and spacecrafts must be designed to withstand this extremehigh acceleration loading force generated at launch from Earth. As usedherein, static or quasi-static acceleration is acceleration that isrelatively constant for an extended period of time and acts primarily ina single direction through the satellite or spacecraft structure. Assuch, this does not include vibrational loading. Further, as usedherein, the “top” of a satellite or spacecraft faces the direction ofacceleration and opposes the loading direction. The “bottom” of asatellite or spacecraft opposes the “top” of the satellite or spacecraftand the “sides” of the satellite or spacecraft are parallel to theacceleration vector.

There are many different ways to accelerate a satellite or spacecraftvia a kinetic launcher. That is, the satellite or spacecraft can be heldfrom a top surface, bottom surface, or one or more side surfaces. Eachscenario generates different acceleration forces. Embodiments of thepresent disclosure describe satellites or spacecrafts that experiencecompression loading during kinetic launch, i.e. loading forces thatcompress the satellite or spacecraft, as opposed to loading forces thatpull the satellite or spacecraft apart or shear the satellite orspacecraft from the sides.

Satellites or spacecrafts that are launched into Earth orbit without akinetic launcher, such as satellites or spacecrafts launched via rocketpropelled systems, primarily need to withstand vibrational loadingduring launch. Satellites or spacecrafts undergoing orbital insertionvia rocket launch will undergo a maximum of 10 times Earth gravity ofquasi-static loading. As such, the loading force that the satelliteneeds to be designed to withstand is much less than the loading forcesubjected upon a satellite or spacecraft launched into Earth orbit via akinetic launcher.

Embodiments of the present disclosure describe structural design changesand ruggedization systems and methods that are necessary for kineticallylaunched avionics. Firstly, due to the extreme high loading forcegenerated during launch of a kinetically launched satellite orspacecraft, avionics on the satellite or spacecraft need to bespecifically designed to withstand the high forces while maintainingstructural integrity. Additionally, avionics on the satellite orspacecraft need to be mass-optimized. Any orbital launch system islimited by the total amount of mass it can get into space or orbit,which also affects a launch's profitability. Furthermore, the heavier anavionics assembly is, the heavier the structure that needs to supportthe avionics assembly needs to be. Therefore, by creating a lighteravionics assembly with embodiments of the present disclosure, entiresatellites and launch vehicles can also be made lighter.

Generally, during a launch process from a kinetic launcher, such as acentripetal launcher or a gun, avionics within a satellite or spacecraftcan experience solder joint failure, printed circuit board flexure,and/or electronic components and/or wire failure under accelerationload. Flexure of a printed circuit board under acceleration load causesplanar deformation in the surface that electronic components are mountedto, which can pose sufficient strain to break solder joints or disbond asolder pad from the printed circuit board substrate. Wires are generallysusceptible to failure under the acceleration load levels seen inkinetic space launch, and current techniques for ruggedizing wires arenot mass-efficient. Often times, potting, which may involveencapsulating electronic assemblies in epoxy adhesive, is a techniqueused to ruggedize avionics; however, potting increases the mass of theavionics.

Embodiments of the present disclosure provide that launch vehicle andsatellite avionics can maintain structural integrity and functionalityin the high g-loading conditions of a kinetic launch through amass-optimized structural design. Thus, structural design techniques andmechanisms are disclosed herein to eliminate failure of solder jointsbetween electronic components and the printed circuit boards they aremounted to, eliminate the use of wires where possible by substitutingtheir use with the use of board-to-board connectors to increase massefficiency, and to fixture and build printed circuit boards in a waythat is rugged to ensure electronics survive the acceleration loads ofkinetic launch. As would be understood by persons of ordinary skill inthe art, while the present disclosure describes satellite and spacecraftlaunch, the ruggedized fixturing methods avionics described herein mayalso be utilized with other types of payloads that are not specificallysatellites or spacecrafts.

Typically, the primary failure mode of avionics under high g-loads isnot at the level of individual electronic components such as integratedcircuits that are mounted to printed circuit boards or passivecomponents, but rather bending of printed circuit boards that causeselectronic components to disassemble from the printed circuit boards.The strain caused by the bending can cause solder joints to fail whichdamages the connections of the electronic components to the printedcircuit board and damages the circuit. The bending of printed circuitboards can be mitigated by aligning printed circuit boards with respectto the acceleration vector in a way that does not promote bending and tosupport printed circuit boards to prevent buckling failure (i.e.,bending in the direction perpendicular to loading).

FIG. 1A depicts a front view of an exemplary embodiment of an avionicsassembly 100 that has been ruggedized to withstand kinetic launchacceleration loading aligned parallel to the plane of a plurality ofprinted circuit boards 110 (PCBs). In exemplary FIG. 1A, PCBs 110 arealigned “vertically” with respect to the acceleration loading vector 120and in parallel to each other. The weight of PCBs 110 and the electroniccomponents mounted to PCBs 110 are transferred to a horizontal supportsurface 130 via compression loading along the plane of PCBs 110 andthrough the bottom edges of PCBs 110. In some embodiments, horizontalsupport surface 130 can be a flat surface provided by a primarystructure of the satellite or launch vehicle, a “floor” of an enclosure,or a flat surface further attached to the primary structure of thesatellite or launch vehicle. As used herein, a primary structure of alaunch vehicle may be all higher order mechanical structure(s) of aspacecraft or satellite such as the “body,” “chassis,” or “frame.” Theprimary structure may also include any structure that attaches to the“body,” “chassis,” or “frame.”

As a result, PCBs 110 do not sustain bending moment and do not flexunder the acceleration loading of kinetic launch. In some embodiments,PCBs 110 are constrained on their vertical edges by slots 140 (alsosometimes referred to herein as “constraining elements”) in verticalside walls 150 in order to constrain PCBs 110 from buckling under thecompression load. Buckling would result in flexure of PCBs 110 andsubsequent solder joint failure. PCBs 110 can be custom-made in order tofit inside slots 140 such that electronic components are not placed allthe way to the edges of the PCBs 110 which would prevent PCBs 110 fromfitting into slots 140. In some embodiments, vertical side walls 150 aremass optimal structures optimized to prevent buckling. For example,vertical side walls 150 may be of a triangularized structure (e.g., anisogrid structure) or have any other mass-optimized geometry towithstand the acceleration loading and provide stiffening.

To further mass-optimize avionics assembly 100, vertical side walls 150may be made of one or more high specific strength and/or stiffnessmaterials that are designed to resist buckling. Exemplary suitable highspecific strength and/or stiffness materials include one or more ofaluminum, titanium, magnesium, beryllium, silicon carbide, and carbonfiber composite. As would be understood by persons of ordinary skill inthe art, other suitable materials may also be used in addition to, orinstead of, the specific components listed here. In some embodiments,vertical side walls 150 may be mounted to horizontal support surface130. For example, vertical side walls 150 may be mounted to horizontalsupport surface with screws, steel screws, glue, or any other mountingmechanisms.

Communication of power and signals between PCBs 110 in avionics assembly100 can be achieved through a “backplane” printed circuit board 160 thatthe vertical PCBs 110 connect to via a board-to-board connector 170 attheir base. In some embodiments, backplane PCB 160 is perpendicular toacceleration loading vector 120. Backplane PCB 160 may comprise coppertraces to provide a communications and power interface between the PCBs110. Backplane PCB 160 may further be protected from flexure and failureby virtue of backplane PCB 160 resting on horizontal support surface130. In other embodiments, communication of power and signals betweenPCBs 110 in avionics assembly 100 can be achieved through a flexibleprinted circuit board joint.

Generally, most surface mount electronic components are able towithstand the shear load of their own weight under the accelerationloads of kinetic launch without solder joint failure when mounted to theside of a vertically aligned PCB such as PCB 110. However, certaincomponents may require additional structural reinforcement. For example,some components that may require additional structural reinforcement areelectronic components that extend far off the surface of the PCB,presenting a substantial cantilever moment to the solder joints,components that have a small solder bond surface area relative to thecomponent's mass, and components that are made of fragile material suchas ferrite. In some embodiments, these components can be structurallyreinforced using epoxy adhesive.

Referring back to FIG. 1 , use of either underfill 180 techniques orstaking 190 techniques are generally effective in ensuring that thesecomponents survive the acceleration loads of kinetic launch withoutfailing. Through underfill 180 techniques, epoxy adhesive may be appliedbetween the underside of an electronic component and the surface of thePCB. Through staking 190 techniques, a fillet of epoxy can be appliedbetween a side of an electronic component and the PCB that theelectronic component is mounted to. In some embodiments, staking 190 canbe done on the side of the electronic components that is facingdownwards towards horizontal support surface 130. In some embodiments,avionics assembly 100 can be enclosed, for example, to protect theavionics assembly 100 from radiation or control avionics assembly 100thermally.

FIG. 1B depicts a top view of the exemplary embodiment of avionicsassembly 100. FIG. 1C depicts an exploded view of the exemplaryembodiment of avionics assembly 100.

FIG. 3A depicts a front view of another embodiment of an avionicsassembly 300 wherein the plurality of PCBs 310 are still alignedvertically with respect to the acceleration vector 320 and mounted to avertical surface 330 of the satellite or spacecraft's primary structure.In FIG. 3A, one of the vertical edges of PCBs 310 is attached directlyto a vertical surface 330 of a satellite or spacecraft's primarystructure using one or more bonded brackets 340. In some embodiments,PCBs 310 and bonded brackets 340 are mounted to vertical surface 330 ofthe primary structure using screws, steel screws, glue, or any othermounting mechanisms.

In FIG. 3A, PCBs 310 effectively act as cantilever beams. Generally,there is a limited set of geometries of PCBs 310 that can accept thissort of loading, and it also depends on the magnitude of theacceleration load. PCBs 310 that are mounted from the vertical edge areat a higher risk of buckling under the acceleration load than directmaterial failure, and buckling must be avoided to ensure that electroniccomponents do not disassemble from PCBs 310 as they bend. Thus,stiffening elements can be attached to PCBs 310 to reinforce PCBs 310and to prevent buckling. In FIG. 3B, which depicts a back view ofavionics assembly 300, and in FIG. 3C, which depicts a top view ofavionics assembly 300, a stiffening frame 350 is mounted to one side ofPCBs 310 to increase PCBs buckling strength several fold. In someembodiments, stiffening frame 350 can comprise one or more triangularsupport structures (e.g., an isogrid). As would be understood by personsof ordinary skill in the art, other suitable geometries may be used forstiffening frame 350. Stiffening frame 350 may be made of one or morehigh specific strength and/or stiffness materials that are designed toresist buckling. Exemplary suitable high specific strength and/orstiffness materials include one or more of aluminum, titanium,magnesium, beryllium, silicon carbide, and carbon fiber composite. Aswould be understood by persons of ordinary skill in the art, othersuitable materials may also be used in addition to, or instead of, thespecific components listed here.

Communication of power and signals between PCBs 310 can be achieved withthe use of board-to-board connectors 360 that connect PCBs 310 directlyto each other, or via a flexible printed circuit board joint. Further,while not explicitly depicted in FIG. 3A, surface mount electroniccomponents mounted to PCBs 310 may be structurally reinforced, forexample, using underfill or staking techniques using epoxy adhesive. Insome embodiments, staking can be done on the side of the electroniccomponents that is facing downwards. In some embodiments, avionicsassembly 300 can be enclosed, for example, to protect the avionicsassembly 300 from radiation or control avionics assembly 300 thermally.

FIG. 4A depicts a front view of another embodiment of an avionicsassembly 400 that has been ruggedized to withstand kinetic launchacceleration loading with a plurality of PCBs 410 aligned horizontallywith respect to the acceleration vector 420. In exemplary FIG. 4A, PCBs410 are stacked on top of each other and each of PCB 410 are supportedby a plurality of spacers 430 to withstand bending of PCBs 410. In someembodiments, spacers 430 may be webbed spacers or spacers of anysuitable geometry to support PCBs 410 and limit the downward flex ofPCBs 410. The weight of PCBs 410 and the electronic components mountedto PCBs 410 are transferred to the satellite or spacecraft's primarystructure (not depicted) upon which avionics assembly 400 is mounted onfirst through transverse shear in PCB 410 to spacer 430 supporting PCB410, then through compression in spacer 430 to another PCB 410 below,and then to another spacer 430 supporting the PCB 410 until thebottommost PCB 410 that rests on a flat surface provided by the primarystructure is reached. In some embodiments, the bottommost PCB 410 mayrest on a horizontal support surface (not depicted) that then rests onthe primary structure. In some embodiments, spacers 430 are all the sameshape such that the weight of spacers 430 gets transferred through PCBs410 into the next spacer 430.

PCBs 410 may be designed such that electronic components are placed awayfrom areas that make contact with spacer 430, allowing spacer 430 todirectly contact the PCB 410 substrate and transfer load to from PCB 410directly. Not only does spacer 430 act as a standoff, but spacer 430also limits the degree that PCB 410 flexes downwards. PCB flexing is theprimary cause of solder joint breakage in surface mount electroniccomponents because bending causes deformation in the surface that theelectronic components are mounted to (i.e., bending strain) whichresults in strain on solder joints that can exceed their structurallimit. In exemplary FIGS. 4A-4C, PCB 410 will flex in the areas that arenot supported, but the webbing in spacers 430 can limit the size of thePCB 410 surface that can flex downwards, thus limiting maximum bendingstrain. The webbing in spacers 430 can limit the “moment arm” of theweight of PCB 410 by supporting PCB 410 at multiple points across PCB410's span, thus limiting maximum bending strain.

Spacer 430 may be made of one or more high specific strength and/orstiffness materials that are designed to resist bending. Exemplarysuitable high specific strength and/or stiffness materials include oneor more of aluminum, titanium, magnesium, beryllium, silicon carbide,and carbon fiber composite. As would be understood by persons ofordinary skill in the art, other suitable materials may also be used inaddition to, or instead of, the specific components listed here. Spacer430 should also be as lightweight as possible so as not to add too muchweight to avionics assembly 400 and designed in such a way that therewill be enough space on PCB 410 for all electronic components.

Generally, components mounted to the top of PCB 410 will not requirestructural reinforcement as they will experience compression into thesurface of PCB 410. Further, PCB 410 substrate may comprise at least onematerial with a higher specific stiffness than traditional FR-4composite. FR-4 is a glass fiber epoxy laminate that comprises thesubstrate of nearly all printed circuit boards. It is formulated to beflame resistant. However, components mounted to the bottom of PCB 410may require structural reinforcement, for example, using underfill orstaking techniques using epoxy adhesive. Further, communication of powerand signals between PCBs 410 can be achieved with the use ofboard-to-board stack connectors 440 that connect PCBs 410 directly toeach other, eliminating the need for wiring between PCBs 410 in avionicsassembly 400, or via a flexible printed circuit board joint. In someembodiments, avionics assembly 400 may be mounted to horizontal supportsurface or horizontal surface of the satellite or spacecraft's primarystructure. For example, avionics assembly 400 may be mounted withscrews, steel screws, glue, or any other mounting mechanisms.

PCBs of any of the exemplary embodiments discussed herein may beconstructed from strengthened materials to make them lighter, improvethermal properties, and reduce the amount of support structure requiredfor the PCBs. Exemplary strengthened materials include one or more ofhigh performance fiberglass, metal, and carbon fiber composite. Further,topology optimization methodologies may be utilized to design any of thesupport structures discussed herein, such as support walls, stiffeningframes, and spacers. In exemplary embodiments, 3D printing may beutilized to make one or more of the topology optimized structures.

FIG. 2 depicts an exemplary method 200 for providing ruggedized avionicsassemblies for use on kinetically launched satellites and spacecrafts.With this method, the avionics assemblies can withstand static andquasi-static acceleration forces of at least 5,000 times Earth'sgravity, in the same direction of loading, during a kinetic launch andmaintain structural integrity and functionality of the avionicsassemblies. In some embodiments, the operations may be combined,performed in parallel, or performed in a different order. The method 200may also include additional or fewer operations than those illustrated.

In step 210, electronic components are mounted to a plurality of printedcircuit boards. In optional step 220, the electronic components may bestructurally reinforced using underfill or staking techniques. In step230, slotted structures are made from one or more high specific strengthand/or stiffness materials. Exemplary suitable high specific strengthand/or stiffness materials include one or more of aluminum, titanium,magnesium, beryllium, silicon carbide, and carbon fiber composite. Aswould be understood by persons of ordinary skill in the art, othersuitable materials may also be used in addition to, or instead of, thespecific components listed here.

In step 240, the plurality of printed circuit boards are inserted intothe slotted structures composed of high specific strength and/orstiffness materials wherein the printed circuit boards are alignedvertically with respect to the acceleration loading vector. In step 250,the plurality of printed circuit boards are connected via board-to-boardconnectors, or via a flexible printed circuit board joint, forcommunication of powers and signals. In step 260, the avionics assemblyis mounted to a satellite or spacecraft's primary structure.

Method and apparatuses have been disclosed herein to provide ruggedizedavionics assemblies on satellites and spacecrafts configured for akinetic space launch. While the disclosure describes various embodimentsof satellites and spacecrafts, the ruggedized avionics assembly may alsobe applied to other types of payloads that are launched kinetically.With this disclosure, the ruggedized avionics assembly can withstandstatic or quasi-static acceleration forces of over 5,000 times Earth'sgravity.

While specific embodiments of, and examples for, the system aredescribed above for illustrative purposes, various equivalentmodifications are possible within the scope of the system, as thoseskilled in the relevant art will recognize. For example, while processesor steps are presented in a given order, alternative embodiments mayperform routines having steps in a different order, and some processesor steps may be deleted, moved, added, subdivided, combined, and/ormodified to provide alternative or sub-combinations. Each of theseprocesses or steps may be implemented in a variety of different ways.Also, while processes or steps are at times shown as being performed inseries, these processes or steps may instead be performed in parallel,or may be performed at different times.

While various embodiments have been described above, it should beunderstood that they have been presented by way of example only, and notlimitation. The descriptions are not intended to limit the scope of theinvention to the particular forms set forth herein. To the contrary, thepresent descriptions are intended to cover such alternatives,modifications, and equivalents as may be included within the spirit andscope of the invention as defined by the appended claims and otherwiseappreciated by one of ordinary skill in the art. Thus, the breadth andscope of a preferred embodiment should not be limited by any of theabove-described exemplary embodiments.

What is claimed is:
 1. A ruggedized, mass-efficient avionics assemblyfor use on a centripetally launched vehicle, the avionics assembly beingconfigured to withstand a static or quasi-static acceleration loadduring a centripetal launch of at least 5,000 times Earth's gravity, theavionics assembly comprising: a plurality of printed circuit boards,each printed circuit board mounted with an at least one electroniccomponent, the plurality of printed circuit boards being attacheddirectly to a primary structure of the vehicle along a vertical edge ofeach printed circuit board using a bonded bracket, the plurality ofprinted circuit boards further being configured to be aligned inparallel with a static or quasi-static acceleration vector directed at acenter of a centripetal launcher, wherein the acceleration vector isgenerated by the centripetal launcher; a plurality of stiffening framesattached to at least one side of at least one of the plurality ofprinted circuit boards; a bracing member is mounted to at least twopoints of each of the stiffening frames on each of the printed circuitboards; and an at least one board-to-board connection configured tofacilitate communication between the plurality of printed circuit boardsthrough at least one of a board-to-board connector or a flexible printedcircuit board joint.
 2. The avionics assembly of claim 1, furthercomprising the avionics assembly being mounted perpendicularly to avertical support surface.
 3. The avionics assembly of claim 2, whereinthe bracing member is attached to and extending horizontally from thevertical support surface, the plurality of printed circuit boards havingat least one horizontal edge substantially perpendicular to the verticalsupport surface, wherein a portion of the stiffening frames extendsparallel and even with the at least one horizontal edge, and the bracingmember is attached to the portion of the stiffening frames.
 4. Theavionics assembly of claim 3, further comprising the bonded bracketsbeing used to attach the bracing member to the vertical support surface.5. The avionics assembly of claim 1, further comprising the bondedbrackets being used to attach the plurality of printed circuit boards tothe primary structure of the vehicle.
 6. The avionics assembly of claim1, further comprising the stiffening frames being comprised of at leastone of a high specific strength or high stiffness material.
 7. Theavionics assembly of claim 6, further comprising the high specificstrength or high stiffness material including at least one of: aluminum,magnesium, beryllium, silicon carbide or carbon fiber composite.
 8. Theavionics assembly of claim 1, further comprising a substrate of one ofthe plurality of printed circuit boards comprising at least one materialwith higher specific stiffness than traditional FR-4 composite.
 9. Theavionics assembly of claim 1, further comprising the stiffening framesbeing designed using topology optimization methods.
 10. The avionicsassembly of claim 1, further comprising the stiffening frames being 3Dprinted.
 11. The avionics assembly of claim 1, further comprising the atleast one electronic component being structurally reinforced.
 12. Theavionics assembly of claim 11, further comprising the at least oneelectronic component being structurally reinforced using underfill orstaking techniques.
 13. The avionics assembly of claim 1 furthercomprising the acceleration load being transferred as a compressiveforce to the centripetally launched vehicle.
 14. The avionics assemblyof claim 1, further comprising an enclosure covering the avionicsassembly, the enclosure being able to protect the avionics assembly fromradiation or to control thermal conditions.
 15. A method for providingruggedized avionics assemblies for use on a centripetally launchedvehicle to withstand static and quasi-static acceleration forces, themethod comprising: mounting at least one electronic component to atleast one of a plurality of printed circuit boards; connecting theplurality of printed circuit boards through an at least oneboard-to-board connector and an at least one flexible printed circuitboard joint for communication and power signals; attaching a pluralityof stiffening frames to at least one side of at least one of theplurality of printed circuit boards; mounting a bracing member to atleast two points of each of the stiffening frames on each of the printedcircuit boards; and mounting the plurality of printed circuit boards tothe centripetally launched vehicle's primary structure along a verticaledge of the plurality of printed circuit boards using a bonded bracket.16. The method of claim 15, further comprising mounting the plurality ofprinted circuit boards perpendicularly to a vertical support surface.17. The method of claim 16, wherein the bracing member is attachedhorizontally to the vertical support surface, the plurality of printedcircuit boards having at least one horizontal edge substantiallyperpendicular to the vertical support surface, wherein a portion of thestiffening frames extends parallel and even with the at least onehorizontal edge, and the bracing member attaching to the portion of thestiffening frames.
 18. The method of claim 17, further comprising usingthe bonded brackets to attach the bracing member to the vertical supportsurface.
 19. The method of claim 15, further comprising using the bondedbrackets to attach the plurality of printed circuit boards to theprimary structure of the vehicle.
 20. The method of claim 15, furthercomprising constructing the stiffening frames out of at least one of ahigh specific strength or high stiffness material.
 21. The method ofclaim 20, further comprising the at least one high specific strength orhigh stiffness material including at least one of: aluminum, magnesium,beryllium, silicon carbide or carbon fiber composite.
 22. The method ofclaim 15, further comprising constructing the plurality of printedcircuit boards from at least one material with higher specific stiffnessthan traditional FR-4 composite.
 23. The method of claim 15, furthercomprising designing the stiffening frames using topology optimizationmethods.
 24. The method of claim 15, further comprising 3D printing thestiffening frames.
 25. The method of claim 15, further comprisingstructurally reinforcing the at least one electronic component usingunderfill or staking.
 26. The method of claim 15, further comprising thestatic and quasi-static acceleration forces generated during acentripetal launch being transferred as a compressive force to thecentripetally launched vehicle.
 27. The method of claim 15, furthercomprising providing an enclosure covering one of the avionicsassemblies to provide protection from radiation or to control thermalconditions.
 28. A printed circuit board housing assembly configured towithstand a static or quasi-static acceleration load during acentripetal launch, the printed circuit board housing assemblycomprising: a plurality of printed circuit boards, each printed circuitboard mounted with an at least one electronic component, the pluralityof printed circuit boards each being attached directly to a primarystructure of a vehicle along an edge of the plurality of circuit boardsusing a bonded bracket; a plurality of stiffening frames attached to atleast one side of at least one of the plurality of printed circuitboards; an at least one board-to-board connection configured tofacilitate communication between the plurality of printed circuit boardsthrough at least one of a board-to-board connector or a flexible printedcircuit board joint; and at least one bracing member attached to andextending approximately normally to a support surface, the at least onebracing member attaching to at least one edge of at least one of theplurality of printed circuit boards; and the at least one bracing memberis mounted to at least two points of the stiffening frames on each ofthe printed circuit boards.
 29. The avionics assembly of claim 1,wherein the at least one bracing member is mounted using steel screwsand wherein the at least one bracing member includes one or more diamondshaped apertures thereby reducing weight.